• 工作国家：中国/China
• 城市：南京
• 招聘人数：3人
• 职位性质：就业岗位
• 学历要求：硕士
• 语言能力：汉语,英语
• 需求专业：一般力学与力学基础,固体力学,流体力学,工程力学,机械制造及其自动化,机械电子工程,机械设计及理论,材料物理与化学,材料学,材料加工工程,电力电子与电力传动,电工理论与新技术,电机与电器,物理电子学,电路与系统,微电子学与固体电子学,电磁场与微波技术
• 职能类别：机械制造类

Job Description

This job opportunity is for an experienced engineer with a thorough and detailed understanding of, and experience with a wide range of electronic packaging processes in a manufacturing environment. The candidate needs to be familiar with wire bonding, solder attach, polymer dispensing, writing work instructions and PFMEA, statistical process control charts, etc., while also having critical volume automated manufacturing expertise in at least one of the process areas.

Responsiblities:

• Develop electronics packaging production processes such as wire bonding, die attach, vacuum reflow soldering, potting, etc.

• Provide technical and engineering support to the manufacturing team

• Develop and conducts statistical analysis such as Design of Experiments (DOE) and Statistical Process Control (SPC) targeting process optimization and high yield process controls for specific electronics packaging manufacturing processes

• Recommend and implement equipment and process modifications to improve production efficiencies, manufacturing techniques and production yields for existing products and processes – lead and/or assist in setting up such equipment

• Interact with product design engineers to ensure that processes and designs are compatible and optimized for future products

Requirements:

• This is a technical engineering position and requires a BS Engineering degree in either Electrical Engineering or Mechanical Engineering. Applicants with an M.S. degree in those disciplines will also be given strong consideration.

• 4+ years electronics processing experience in an automated semiconductor manufacturing environment or mix of equivalent education and industry experience.

• Knowledge of 175° C rated electronic packaging materials and wide band gap semiconductors

• Experience with some of the following processes: wire bond interconnection (125-500 um diameter), vacuum soldering, x-ray or CSAM solder analysis, laser processing, hermetic seam sealing, ceramic/metal packages, electrolytic and electroless plating, CAD based fixture or equipment component design

• Technical project planning experience

• Excellent English communication skills (i.e. verbal, written, and presentation)

• Excellent team player

Highly preferred skills and certifications:

• >7 years electronics processing experience in an automated semiconductor manufacturing environment.

• Knowledge of new state-of-the-art devices such as SiC JFETs, MOSFETs, TMOS, thyristors, Schottky Diodes, etc.

• Experience working in a cleanroom environment (Class 10000 or better)

• Experience in several of the following areas: power electronics/modules packaging processes, wire bonding, x-ray and CSAM analysis, production tools, and equipment, statistical analysis tools and software, engineering design tools such as SolidWorks, COMSOL, ANSYS, etc., mechanical and/or electrical systems.

Semiland was founded in Yangzhong city, Jiangsu province Feb, 2017， and its Nanjing office has been registered in May, 2018 and is located inside Ju Bao Shan park.  The company is dedicated to developing innovative power electronics module packaging technologies for wide band gaps devices to unleash their performance to the maximum extreme. Starting from innovative packaging technology and system integration of  SiC power module, the market orientation will be aligned in new energy vehicle, high speed welder, rail, power supply, and UPS..etc. and also provide customer oriented services to optimize thermal management and system  performance.